Intro Tech specs

Efficient wafer sawing requires the careful optimization of numerous variables, including machine speed, wire tension, slurry composition, and temperature level. Znshine group optimizes its wafer sawing process to match its ingot production and feedstock supply while producing wafers that match industry benchmarks for wafer quality and thickness.

Currently, we slice monocrystalline wafers to a 200 micron thickness, while maintaining a low breakage rate. After the ingots are inspected, monocrystalline ingots are squared by squaring machines. Through high-precision cutting techniques, the squared ingots are then sliced into wafers by wire saws using steel wires and silicon carbon powder. To produce multicrystalline wafers, multicrystalline ingots are first cut into pre-determined sizes. After being inserted into frames, the wafers go through a cleansing process to remove debris from the previous processes, and are then dried. Wafers are inspected for contaminants and packed andtransferred to our solar cell production facilities.

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