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182
  • PERC
  • TOPCon
    • 182 Single Glass Module Series
      Des: The series integrates 182mm large-size silicon wafers increases the wafer size, optimizes the layout profoundly and decreases the invalid power generation area. Multi-busbar, uniform smart soldering increases the power and efficiency of the module, and improves the load capacity. With MBB and Half-Cell technology, the maximum power breaks through 590W+
    • 182 Double Glass Module Series
      Des: Dual-glass module is based on 182mm large-size silicon wafers, high power, high efficiency, high compatibility, high quality and low BOS. It can reduce the risk of fire, increase moisture resistance, anti-corrosion property to acid and alkaline solution.
    • 182 Bifacial Double Glass Module Series
      Des: The product combines 182mm large-size silicon wafers with PERC, multi-busbar, half-cut,and improve the energy density of the module with high-density cell interconnect technology and bifacial technology. In addition, depending on the installation environment, the backside power gain is about 25%. This series is suitable for utility-scale power stations and distributed project.
    • 182 TOPcon Single Glass Module Series
      Des: Refresh the experience of high efficiency. The series adopts N-type TOPCon cell and features high-density packaging, enhanced reliability, non-destructive cutting and other technologies to achieve the core strengths of ultra-high power generation/ultra-high efficiency, lower LID / LETID, optimized temperature coefficient, good capture in low light effect and high compatibility.
    • 182 TOPcon Double Glass Module Series
      Des: Dual-glass module is based on 182mm N-type TOPCon, high power, high efficiency, high compatibility, high quality and lower temperature coefficient. It has better resistance and can reduce the probability of fire, increase moisture resistance, anti-corrosion property to acid and alkaline solution
    • 182 TOPcon Bifacial Double Glass Module Series
      Des: The product combines 182mm large-size silicon wafers with N-type TOPCon, multi-busbar, half-cut, and improve the energy density of the module with high-density cell interconnect technology and bifacial technology. The backside generates electricity up to 25%, it effectively absorbs the incident light in the positive side and reflected and scattered light in the back side, outputs enough power.
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